This system can be used for deposition of maximum three different materials on a single substrate using thermal evaporation technique.

It also allows simultaneous deposition of three different materials at the same time on the same substrate.

  • Base Pressure < 5x10-8 Torr
  • Leak Rate < 10-8 Torr.l/s
  • Substrate Size 4" diameter
  • Substrate Heating Max. 800 oC
  • Substrate Rotation 3 - 30 rpm
  • Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
  • Deposition Method Resistive Thermal Evaporation
  • Deposition Mode Upward (all sources)
  • Number of Sources 3
  • Power Generators 3
  • Control Full automation by PC

For more detailed information, send an e-mail to

Other Thermal Evaporation