Designed and manufactured to deposit controlled nano- and micro-meter-thick thin films/coatings on flat surfaces of max. 4" diameter wafers or glass. Includes three thermal evaporation sources.

  • Base Pressure < 2x10-7 Torr
  • Leak Rate < 10-8 Torr.l/s
  • Substrate Size 4" diameter
  • Substrate Heating Max. 500 oC
  • Substrate Rotation 3 - 30 rpm
  • Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
  • Deposition Method Resistive Thermal Evaporation
  • Deposition Mode Upward (all sources)
  • Number of Sources 3
  • Loading From top
  • Control Full automation by PC

For more detailed information, send an e-mail to

Other Thermal Evaporation