MiDAS Twin
MiDAS Twin System
This system is comprised of two chambers with a common pumping station. One of the chambers utilizes e-beam and the other utilizes sputtering and thermal evaporation techniques. Each chamber allows deposition of four different materials in a single loading on a same substrate.
- Ultimate Vacuum Pressure ≤ 5x10-8 Torr
- Leak Rate < 10-8 Torr.l/s
- Number of Chambers 2
- Substrate Size 4” diameter
- Substrate Heating max. 800oC
- Substrate Rotation 3-30 rpm
- Cooling Where necessary
- Deposition Mode Upward
- Resistive Thermal Evaporation Sources 3
- Sputtering Magnetron Source 1
- E-beam evaporator Source 1
- Power Generators 3
- Load lock chamber Optional
- Control Fully Automatic
For more detailed information, send an e-mail to info@vaksis.com.
