Multi Technique Thin Film Deposition System:

This system can be used for deposition of maximum four different materials on a single substrate using sputtering and thermal evaporation techniques.

  • Base Pressure < 5x10-8 Torr
  • Leak Rate < 10-8 Torr.l/s
  • Substrate Size 4" diameter
  • Substrate Heating Max. 800 oC
  • Substrate Rotation 3 - 30 rpm
  • Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
  • Sources 2 Resistive Thermal Evaporation, 2 Sputtering Magnetrons 
  • Deposition Mode Upward 
  • Power Generators 1 DC (500 W) and 1 RF (300 W)
  • Control Full automation by PC
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For more detailed information, send an e-mail to info@vaksis.com.

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