Multi Technique Thin Film Deposition System:

This system can be used for deposition of maximum five different materials on a single substrate using magnetron sputtering and thermal evaporation techniques.

  • Base Pressure < 5x10-8 Torr
  • Leak Rate < 10-8 Torr.l/s
  • Substrate Size 4" diameter
  • Substrate Heating Max. 800 oC
  • Substrate Rotation 3 - 30 rpm
  • Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
  • Deposition Mode Upward
  • Number of Sources 6
  • Resistive Thermal Evaporation Sources 3
  • Sputtering Magnetron Sources 2
  • Remote Plasma Sources 1 ICP LN-Cooled Shrouds
  • Power Generators 3
  • Loading From the front door
  • Control Full automation by PC
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For more detailed information, send an e-mail to info@vaksis.com.

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